Teledyne e2v Expands High-Reliability Product Portfolio for Aerospace and Space Applications with New Processor and Memory Solutions

Teledyne e2v proudly announces the release of two groundbreaking products designed to meet the stringent requirements of aerospace and space applications: the military-qualified LX2160 processor and the space-qualified 8 GB DDR4 memory chip.

These innovations underscore Teledyne e2v’s commitment to providing high-performance, reliable solutions for demanding environments.

Military-Qualified LX2160 Processor for Aerospace and Defense

Teledyne e2v has qualified and released an upscreened version of NXP’s LX2160 16-core Arm® Cortex® A72 based processor to operate within a wide temperature range of -55°C to +125°C. This processor delivers unparalleled performance in the smallest form factor with an optimized power envelope, making it ideal for AI-at-the-Edge computing systems, single-board computers (SBCs), and other compute-intensive applications in aerospace and defense.Compared to the previous generation LS1046 processor, the LX2160 offers a 2.6 times increase in Giga instructions per Watt, with 4 times more cores and 6 times more DMIPS (201k DMIPS @ 2.2 GHz). This processor supports 2 DDR4 interfaces, 100 GbE, multiple PCIe Gen3.0, and SATA Gen3.0, facilitating faster data switching and routing. Additionally, it allows for easy migration of software assets developed on Arm® based systems to more compute-intensive designs.

“The military qualification of NXP’s flagship LX2160 processor enables Teledyne e2v to deliver the high performance needed for aerospace and defense applications. We are already working to generate a space-qualified version of the LX2160 for launch next year,”

says Thomas Guillemain, Marketing and Business Development Manager of Digital Processing Solutions at Teledyne e2v.

Samples of the military-qualified LX2160 processor are available today. For more information, please visit: Teledyne e2v LX2160 Processor.

Space-Qualified 8 GB DDR4 Memory for Advanced Satellite Systems

Teledyne e2v has successfully qualified its 8 GB space DDR4 memory chip, tailored for edge compute solutions in space. This ultra-compact, resilient memory chip is designed to increase SWaP (Size, Weight, and Power) efficiency for advanced satellite missions, including communications, Earth observation, scientific research, and edge computing roles.

The 8 GB DDR4 memory chip offers double the capacity of its 4 GB predecessor while maintaining the same form factor (15mm x 20mm x 1.92mm) and pin compatibility. It supports a transfer rate of 2400 MT/s and is single-event latch-up (SEL) immune up to 60 MeV.cm²/mg, providing 100 krad total ionizing dose (TID) resilience and SEU data up to 60 MeV.cm²/mg.

Thomas Guillemain highlights,

“Fast memory is a critical component in modern data-intensive satellites. The new 8 GB part doubles storage density in the same compact form factor of our previous 4 GB. With multiple temperature grades and qualification variants up to NASA level 1, Teledyne e2v offers a diverse, ruggedized, and versatile space-grade portfolio.”

Qualified engineering models (EMs) of the 8 GB DDR4 memory are available now, with flight models (FMs) under construction and planned for early 2025. For further details, please visit: Teledyne e2v 8 GB DDR4 Memory.

About Teledyne e2v

Teledyne e2v’s innovations lead developments in healthcare, life sciences, space, transportation, defense and security, and industrial markets. The company’s unique approach involves listening to customer challenges and partnering to provide innovative standard, semi-custom, or fully custom solutions, adding significant value to their systems.